Revolutionizing the future of photovoltaics, one step at a time.

Step

1

Release layer formation

The first step in our patented process is creation of a precisely engineered silicon release layer on the seed wafer substrate with scalability to mass production.

Step

2

Deposition

The heart of the EpiNex® process is the high throughput in-line CVD direct ‘gas to wafer’ deposition process. This enables >60% less energy consumption than conventional CZ and wafering and significantly less waste.

Step

3

Detachment

The EpiNex® wafer is detached from the seed wafer substrate and the seed wafer recycled for continued use.

Step

4

Post Treatment

The EpiNex® wafer undergoes a final post treatment and is ready for packaging.

Step

5

The EpiNex® wafer

The finished wafer offers the highest level of quality and repeatability and is a drop in replacement for conventional CZ wafers.

The Nexwafe way

EpiNex® technology reduces waste in wafer manufacturing by almost 50%

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