Revolutionizing the future of photovoltaics, one step at a time.
Step
1
Release layer formation
The first step in our patented process. In contrast to slow, single-wafer processing, we leverage in-line release layer formation and equipment to enable easy and efficient mass production.
Step
2
Deposition
Next, we move straight to deposition, via chemical vapour-phase epitaxy (again, a patented process.) This high-throughput technique achieves enormous savings in terms of energy and silicon used.
Step
3
Detachment
Now the free-standing silicon NexWafe wafer can be detached from the seed wafer. There’s no need for temporary substrates in subsequent cell processing steps, and the seed wafer can be recycled back into the production chain.
Step
4
Post treatment
After detachment, the wafers undergo post treatment to ensure they're free from any remnant of the seed substrate.
Step
5
The NexWafe Wafer
The finished product – ultra thin, highly efficient drop-in replacements for conventional 120-140 μm wafers, produced with for 50% less cost and with a 75% reduction in CO2 emissions.