Revolutionizing the future of photovoltaics, one step at a time.

Step

1

Release layer formation

The first step in our patented process. In contrast to slow, single-wafer processing, we leverage in-line release layer formation and equipment to enable easy and efficient mass production.

Step

2

Deposition

Next, we move straight to deposition, via chemical vapour-phase epitaxy (again, a patented process.) This high-throughput technique achieves enormous savings in terms of energy and silicone used.

Step

3

Detachment

Now the free-standing silicon NexWafe wafer can be detached from the seed wafer. There’s no need for temporary substrates in subsequent cell processing steps, and the seed wafer can be recycled back into the production chain.

Step

4

Post treatment

After detachment, the wafers undergo post treatment to ensure they're free from any remnant of the seed substrate.

Step

5

The NexWafe Wafer

The finished product – ultra thin, highly efficient drop-in replacements for conventional 120-140 μm wafers, produced with for 50% less cost and with a 75% reduction in CO2 emissions.

Our technology roadmap

A brighter future

Learn more
The Nexwafe way

Our long-term roadmap will increase production efficiency by 50%

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