EpiNex® wafers are manufactured using NexWafe’s breakthrough direct gas-to-wafer epitaxy process, eliminating both the slow, energy-intensive Czochralski (CZ) crystal growth and wire saw process. Unlike conventional wafers, which are sliced from ingots with high silicon losses, EpiNex® wafers are grown directly to final thickness, dramatically improving material efficiency and reducing energy consumption. Designed for seamless integration, EpiNex® wafers are fully compatible with today’s leading solar cell technologies, including HJT, TOPCon, and MWT.

#1 EpiNex®:

Proven Product Advantages

Thin & Ultra-Thin Wafers: Available in thicknesses from 150 μm down to 50 μm

  • Exceptional uniformity for ultra- thin wafers for space and aerospace applications
  • Tunable surface morphology for superior flatness/topology

Low Oxygen Content: Up to 40x lower than CZ wafers

  • Enhances thermal stability during processing
  • Reduces efficiency loss in emitter formation
  • Eliminates the root cause of light-induced degradation (LID)

Precision Process Control:

  • Enables engineered dopant profiles for optimized junctions
  • Consistent wafer-to-wafer resistivity for high process repeatability
#2. EpiNex®: 

Advanced n-type HJT Solar Cell with 24.4% efficiency on EpiNex Wafer

Lower Carbon Footprint & Resource Use

  • Uses 50% less energy by eliminating energy-intensive Siemens & CZ
  • Wire saw eliminated. Higher material yield as there is no kerf loss
  • Reduces waste through recycling of seed wafers and exhaust gases
  • Eliminates the need for a saw damage etch in the cell processing
  • #1 EpiNex wafers (left) were a drop in replacement in leading HJT cell line with no process optimization required
#3. EpiNex®: 

Enabling A Domestic Supply Chain

Western Equipment

  • EpiNex® uses Western manufacturing equipment

Commodity Feedstock

  • Uses Trichlorosilane (TCS) or Silicon Tetrachloride (STC)
  • Commodity pricing of these feedstocks are stable
  • Manufacturing of feedstock is co-located with EpiNex® factory

Locally Sourced Materials

  • No critical material imports required
  • Enables 100% domestic content compliance. No imports
Process Tunable Wafer Thickness

Ultra-thin wafers

As wafers become thinner—down to 50μm and below—they are inherently flexible. This reduces brittleness and cracking risk. This characteristic enables improved handling and opens opportunities for next-generation module solutions for PV applications in space, aerospace and vehicle integration.

Today and tomorrow

Extending the efficiency of solar cells: Next Generation Tandem Junction

Within the next decade EpiNex® wafers are on track to perfect tandem junction devices with efficiencies to 30%. Tandem junction devices benefit from the improved resistivity, quality and repeatability provided by the EpiNex® process. NexWafe has partnered with CSEM to make build 28.9% efficient tandem junctions cells.

The NexWafe way

EpiNex®: Tunable Thickness, Low Carbon Footprint, and Maximum Material Efficiency for Next-Gen Solar Cells

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